NXP RF Airfast Multi-Chip Modules Support the 5G Rollout in Japan

NEC Corporation has selected NXP Semiconductors to supply their RF Airfast Multi-chip Modules to be used in a Massive MIMO 5G antenna Radio Unit (RU) for Rakuten Mobile, one of Japan’s leading mobile network operators.

NEC’s Massive MIMO 5G Antenna RU features a 5G open virtual radio access network (vRAN) interface and has been adopted by Rakuten Mobile for its fully virtualized cloud-native mobile network. The RU utilizes extremely accurate digital beam forming for efficient high-capacity transmission and is easy to install as a result of miniaturization achieved through an increased level of circuit integration.

NXP’s new AFSC5G40E38 RF Airfast multi-chip module was developed to meet the frequency and power requirements of Japan’s 5G infrastructure deployment. It is a fully integrated Doherty power amplifier module designed for wireless infrastructure applications that demand high performance in the smallest footprint. Ideal for applications in massive MIMO systems, outdoor small cells and low-power remote radio heads. The device is part of an expanding portfolio of NXP RF Airfast multi-chip modules being developed to enable 5G infrastructure deployments throughout the world. NXP’s RF Airfast multi-chip modules offer a common footprint across frequency and power for different regions, enabling faster time to market for network mobile operators. The AFSC5G40E38, a field-proven LDMOS power amplifier is designed for TDD and FDD LTE systems.

NEC teamed up with Rakuten Mobile to develop and manufacture the 5G infrastructure that leverages NXP’s RF Airfast Multi-chip Modules. These modules support the frequencies and power levels needed for Japan’s 5G infrastructure and the technology’s flexibility, integration, and performance allows them to quickly and effectively develop radio products for 5G infrastructure.