Infineon Introduces Wi-Fi 6/6E and Bluetooth 5.2 Combo Module for IoT and Streaming Devices

Infineon Technologies AG is expanding its wireless portfolio of high-performance, reliable and secure offerings. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for the IoT, enterprise, and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer, and automotive applications. The Wi-Fi 6/6E combo solutions operate in the 2.4 GHz, 5 GHz, and the new, greenfield 6 GHz spectrum to deliver robust performance and minimal latency. This makes them ideal for high-quality video and audio streaming applications like gaming consoles, AR/VR, smart speakers, media-streaming devices, and automotive Infotainment. Applications that require an instant response like security systems and industrial automation will also benefit from Infineon’s new products.

Infineon’s AIROC Wi-Fi 6/6E-certified solutions go above and beyond the standard requirements to elevate user experience with advanced wireless technology and architectural innovations that result in:

  • Double the wireless coverage range compared to Wi-Fi 5 and Wi-Fi 4.
  • 40 percent more coverage than typical Wi-Fi 6/6E solutions.
  • Improved connection robustness with enhanced interference mitigation.
  • Lower latency and better Wi-Fi/BT Coexistence that improves multimedia streaming and gaming responsiveness in overlapping network environments.
  • Over 20 percent power savings, enabling longer battery life.
  • Multi-layer security protections with a secured boot, firmware authentication and encryption, and lifecycle management, enabling a higher level of security for IoT applications.

AIROC Wi-Fi 6/6E combo solutions address the challenges of congested 2.4 GHz and 5 GHz channels and bring extraordinary audio and video quality for media applications and robust, long-range connections for IoT applications.

Infineon's AIROC Wi-Fi 6/6E solutions are also equipped with the latest Bluetooth 5.2 technology, enabling high-quality audio with LC3, and enabling new BLE audio use cases such as audio sharing and audio broadcast. The unique low-power Wake-on-Bluetooth LE mode allows the host CPU to conserve power while the Bluetooth core autonomously “listens” for incoming connection requests. Advanced wireless technology innovations have been added to improve BT/BLE range, robustness, latency, and power savings above and beyond standard BT5.2. Infineon’s unique Smart Coex maximizes Wi-Fi throughput when used concurrently with Bluetooth, and optimizes for demanding multi-media use cases.

Infineon’s module partners build Wi-Fi 6/6E integrated solutions that allow for rapid development, reduced test costs, and product certification. “Collaborating with Infineon allows us to leverage our combined expertise to develop innovative Wi-Fi solutions which further build upon our market-leading position,” said Akira Sasaki, General Manager of Murata. “Our most recent collaboration is a Wi-Fi 6/6E CYW5557x module that delivers advanced technology integration, superb network quality, and enables fast time-to-market. Further, it can be delivered through Murata’s extensive sales and distribution channel.”

LG Innotek is excited to partner with Infineon on the new Wi-Fi 6E communication module which carries the CYW89570 chip,” said Insoo Ryu, Vice President Automotive Components & Electronics Business Division, LG Innotek. “This module extends LGIT’s automotive/industrial product family into the next generation and brings the latest Wi-Fi 6E and Bluetooth 5.2 standards to automotive platforms.”

For automotive applications, u-Blox builds AECQ100 qualified and industrial modules with Infineon’s Wi-Fi 6E combo solution. “At u-Blox, we are excited to work with Infineon on the new CYW89570,” said Hakan Svegerud, Senior Director Product Strategy, u-Blox. “Based on these solutions, we will extend our successful JODY module family with global automotive and industrial grade modules, providing cutting edge technologies including Wi-Fi 6, Wi-Fi 6E, and Bluetooth 5.2 to our customers.”

“nFore’s NF3327PQ Combo module has Infineon’s CYW89570 chipset inside. Infineon’s CYW89570 chipset is the perfect chipset for enabling Wi-Fi 6 and Bluetooth 5.2 technologies for automotive customers,” said Mr. Yu Zongyuan, CEO of nFore Technology.

Availability

The AIROC Wi-Fi 6 / 6E and Bluetooth 5.2 combo is currently sampling to select customers. It will be on display at Infineon’s virtual Embedded Solutions Conference 2021.