High Power RF PCB Technology Sees Surge in Orders


Cirexx International has announced that they have received over $1M in orders since launching their ECLIPS technology for antenna and communications applications.  ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.

The Cirexx ECLIPS technology serves as an alternative to co-fired ceramics and hybrid integrated circuits.  The item is essentially a common Printed Circuit Board, made from otherwise typical RF/microwave Printed Circuit Board materials and processes.  But with a high thermal conductivity and very low CTE the user can direct attach and wire-bond bare die such as GaN and GaAs.  The other electronic components on the board can be standard “plastic parts” attached in a standard process such as a vapor phase soldering.  This results in an electronic board system that is smaller, lighter weight, easier to make revisions to and certainly much less costly than the ceramic hybrid, all-die alternative. The ECLIPS technology has had a very enthusiastic acceptance from RF engineers looking for a cost effective, high power alternative.