Peregrine Introduces Next-Gen 300 mm UltraCMOS RF SOI Platform

UltraCMOS

Peregrine Semiconductor has announced that its next generation UltraCMOS RF SOI platform is now in production. The 300 mm UltraCMOS 12 process boasts the industry’s lowest Ron Coff performance level of 80 fs - a 25-percent improvement over the last generation. To develop the 300 mm UltraCMOS 12 platform, Peregrine collaborated with GLOBALFOUNDRIES, a leading full-service semiconductor foundry.

Ron Coff is a key metric for RF switching and it is Peregrine’s performance benchmark for each new generation of the UltraCMOS platform. RONCOFF is a ratio of how much loss occurs when a radio signal goes through a switch in its ON state (RON, or on-resistance) and how much the radio signal leaks through the capacitor in its OFF state (COFF, or off capacitance). With each new UltraCMOS generation, Peregrine targets a 20-percent improvement in RONCOFF. UltraCMOS 12 technology surpasses this target and sets a new industry standard for RONCOFF performance.

UltraCMOS 12

UltraCMOS 12 technology, like the two generations prior - UltraCMOS 10 and 11, uses a custom fabrication flow from GLOBALFOUNDRIES. This collaboration between Peregrine and GLOBALFOUNDRIES yields industry-leading advancements. UltraCMOS 11 technology, introduced in July 2015, was the industry’s first RF SOI 300 mm platform, and UltraCMOS 10, introduced in October 2013, delivered the industry’s best RONCOFF performance, at the time.

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