Sequans & ST to Showcase Turnkey LTE-M IoT Design Kit at MWC 2017

Sequans Communications and STMicroelectronics have collaborated to facilitate the HW and SW combination of ST’s STM32 microcontroller platform with Sequans’ Monarch LTE-M chipset platform in a design kit for IoT connectivity. The solution will be demonstrated at the Mobile World Congress 2017.

The IoT design kit will simplify device design and speed up time to market for makers of connected IoT devices, including wearables, connected healthcare devices, smart city and smart home devices, asset trackers, agriculture and industrial IoT devices.

Monarch is the world’s first purpose-built IoT chip to appear in the market that is compliant with the 3GPP Release 13 LTE-Advanced standard defining narrowband LTE-M and developed to support low power and low data rate applications for the Internet of Things.

The STM32 family is the leading ARM Cortex-M-core 32-bit microcontroller platform comprising of ten product series that address a large range of applications. The IoT design kit will be demonstrated at the STMicroelectronics exhibit stand at the Mobile World Congress in Barcelona, February 27 - March 2, 2017.