Richardson RFPD to Sponsor EDI CON 2017 GaN Panel

Richardson RFPD has announced that they will be sponsoring the upcoming Electronic Design Innovation Conference (EDI CON) 2017 GaN Panel workshop event to be held from April 25 - 27 in Shanghai, China. Richardson RFPD's GaN Panel is scheduled on April 26th at 14:50 to 15:30 (local time).

EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets.

The GaN Panel, this year entitled, “The Future Outlook of RF GaN: Applications and Performance” will be a moderated round table discussion featuring gallium nitride (GaN) experts from MACOM, NXP, Strategy Analytics and Wolfspeed. The proliferation of GaN in commercial RF applications is reaching a critical mass, which creates a virtuous cycle as the price/performance tradeoffs open even more opportunities to use GaN. The participants in the panel represent several companies invested in RF GaN, and multiple points of view will be discussed. The panel will be moderated by Gary Lerude, Technical Editor of Microwave Journal.

Click here for additional details about the GaN Panel workshop.