Gore Showcases PHASEFLEX Microwave/RF Test Assemblies at EDICON China 2017

W. L. Gore & Associates (Gore) is showcasing its new GORE PHASEFLEX Microwave/RF Test Assemblies at the ongoing EDICON China 2017 event being held in Shanghai from April 25-27. The Type 0N, High Density Test/Interconnections are one of the smallest, lightest, most internally ruggedized assemblies for modular, multi-port, and multi-site test applications. The high-density test assemblies ensure consistent, repeatable measurements with stable electrical performance up to 50 GHz.

Building on the portfolio of GORE PHASEFLEX Microwave/RF Test Assemblies, the unprecedented small package and light weight of Type 0N not only makes initial routing much easier in cramped spaces but also reduces the stress on test ports and DUTs as cables are connected to test instrument ports and fixtures. The high-density test assembly also withstands continuous movement and flexing while delivering enhanced phase and amplitude stability.

Connecting the new Type 0N Microwave/RF Test Assemblies to a test application eases calibration and troubleshooting, improves test results, speeds throughput, increases service life, and reduces overall costs. It also offers stable electrical performance and durable mechanical protection over time in a compact, cost-effective package.

The combination of protection and performance coupled with reduced size and weight makes the new Type 0N PHASEFLEX Microwave/RF Test Assemblies ideal for modular, multi-port, and multi-site test applications such as:

  • 5G test and interconnection
  • Component/device R&D and production test
  • High-speed digital test devices/assemblies
  • Modular test instruments such as PXIe and AXIe
  • RF switches