Ceramic RFID Package with Embedded Antenna Increases Read Range by 2X

Kyocera Corporation have developed an ultra-small ceramic RFID package utilizing a proprietary multilayer structure with a built-in RFID antenna that increases the read range up to 2X when compared with conventional packages of the same size.

This compact package with outstanding performance has been developed using Kyocera’s proprietary technologies cultivated over many years in advanced ceramic materials and multilayer structures. The new ceramic package with a RFID antenna will help meet the rising demand for RFID tags to support Internet of Things (IoT) applications.

As production of IoT devices continues to expand, RFID technology is expected to proliferate into the automotive and medical industries, factory automation and many other industrial fields. While packages utilizing organic or resin-based materials will be utilized for conventional RFID tags in common retail applications, many other applications will require durable RFID packages with higher resistance to harsh environments such as water, heat and chemicals, while still delivering greater read ranges.

Up to 2X communication distance in the UHF band while maintaining compact size

In UHF band testing, this new ceramic package with an embedded RFID antenna provided a read range between 1.5 and 2 times that of conventional RFID tags of the same size. Even as package size decreased, the Kyocera low-profile thin multilayer cavity structure continued to outperform the conventional RFID tags of similar outlines.

LTCC material offers excellent high-frequency properties and high flexural strength

These RFID packages are an excellent example of Kyocera’s extensive multilayer ceramic capability, using a proprietary Low Temperature Co-fired Ceramic (LTCC) formulation and a copper conductor metallization system. The packages take advantage of the low-loss and high-frequency benefits of LTCC, yet deliver the high flexural strength expected from High Temperature Co-fired Ceramic (HTCC).

Cavity structure for IC chip protection and ultra-small tag design

With a cavity designed specifically for an IC chip, this package offers excellent protection against mechanical stress and impact, while facilitating ultra-small, low-profile tag design.

Suitable for metallic products

In contrast to traditional tags that tend to block RF signals, Kyocera’s ceramic package is designed to maximize read range in proximity to metal. This expands RFID feasibility in applications involving metallic products or objects, opening new potential uses in automotive, factory automation, healthcare and many other fields.

Wide range of products

Kyocera offers many options to meet diverse customer requirements. The packages are available in six base configurations - three different sizes for both the UHF and HF (for ultra-short-distance communication) bands. To meet diverse customer demands, the company offers built-in IC chip arrangement and device assembly, providing RFID tags as finished products, in addition to providing ceramic packages and customized designs upon request.

Mass Production of this RFID Package will begin in May 2017, and the product will be available worldwide in three sizes (from 6 x 3 x 1.7 mm to 15 x 5 x 1.7 mm).