NEO Tech to Focus on Substrate & Microelectronic Assembly at IMS 2017

NEO Tech has announced that they will be showcasing their high-reliability substrate and microelectronic assembly capabilities at the 2017 International Microwave Symposium, which is scheduled to take place June 6 - 8, 2017 in Hawaii. During the symposium, NEO Tech will feature a range of its low-temperature co-fired ceramic (LTCC), high-temperature co-fired (HTCC), and microelectronics packaging technologies, including the following:

  • Ceramic Substrate manufacturing: thick film, ECP thick film, BeO substrates, AlN systems, plating and HTCC/LTCC package assemblies.
  • Extensive high-reliability microelectronics assembly technology including die attach, ceramic package wirebonding, COB laminates, device hermetic sealing and extensive product testing validation services.
  • Innovative AUTOLINE to economically produce complex RF microelectronic packages

Additionally, the company will discuss its high frequency millimeter and microwave microelectronics assembly experience, which include package assembly, sealing and testing.