NEO Tech to Showcase Substrate & Microelectronic Assembly Capabilities at IMS 2017

NEO Tech, a leading provider of manufacturing technology and supply chain solutions has confirmed its participation for the upcoming International Microwave Symposium 2017 (IMS). The company will be showcasing its high-reliability substrate and microelectronic assembly capabilities at the event which is scheduled from June 4 - June 9, 2017 in Hawaii.

During the symposium, NEO Tech will feature a range of its low-temperature co-fired ceramic (LTCC), high-temperature co-fired (HTCC), and microelectronics packaging technologies, including:

  • Ceramic Substrate manufacturing: thick film, ECP thick film, BeO substrates, AlN systems, plating and HTCC/LTCC package assemblies.
  • Extensive high-reliability microelectronics assembly technology including die attach, ceramic package wire-bonding, COB laminates, device hermetic sealing and extensive product testing validation services.
  • Innovative AUTOLINE to economically produce complex RF microelectronic packages

Additionally, the company will also be discussing its high frequency millimeter and microwave microelectronics assembly experience, which include package assembly, sealing and testing.

Click here to see IMS 2017 Coverage on everything RF.