Indium Corporation to Discuss Changing Requirements of High-Temp Solders for RF Semiconductors

This year’s IMAPS High Temperature Electronics Network 2017 (HiTEN 2017) will feature an expert presentation from the high-temperature applications specialist of Indium Corporation, Bernard Leavitt. The presentation, entitled, Die-Attach Voiding Reduction in Gold Alloy Solder Pre-forms, will discuss the changing requirements of high-temperature solders in RF and power semiconductor device assembly, as both power density and ratings of these devices increase. The event is scheduled from July 10 – 12, 2017 in Cambridge, United Kingdom.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. AuSn20 (Indalloy182), an offering from the company, has been one of the workhorses for high-temperature, high-reliability, small die-attach applications for many years. However, the gold-tin eutectic solder alloy is beginning to reach its utility limit. Leavitt will review the next options available to RF and power semiconductor manufacturers at the event.

A Product Specialist, Leavitt, is responsible for promoting and growing Indium Corporation’s product line for high-temperature applications. He works with the sales teams to identify current and potential customer accounts, and handles customer communications and product inquiries. After joining the company in 2007, he was soon promoted to Account Coordinator responsible for relationship management in 2010. Leavitt attended the State University of New York at Morrisville and earned his bachelor's degree in Business Management from the State University of New York's Empire State College.