Cirexx to Demonstrate its Latest RF/Microwave PCB Advancements at the Auvsi Pathfinder Symposium

Cirexx International will be exhibiting its diverse PCB portfolio at this year’s AUVSI Pathfinder Symposium from August 22 - 24 in Huntsville, AL. The company will be demonstrating its complete product line of advanced Printed Circuit Boards, including HDI and RF/Microwave and Flex Circuits, including Rigid-Flex. Application engineers will be available at the Cirexx booth to discuss the latest technology in these areas as well as Cirexx in-house design and component assembly services.

The company will also be featuring its latest ECLIPS (Embedded Cooling Layer – Integrated Power System) technology. It is a system for producing high-power RF/microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.

Cirexx products are used in many applications in addition to defense/aerospace, including medical, telecommunication and industrial controls and thus believes that the show is an excellent chance for them to grow in the Huntsville area, a critical location for some of the country’s premier aerospace/defense companies; as well as build its customer base.

The symposium is sponsored by AUVSI and hosted by the Pathfinder Chapter in Huntsville. The presentations will vary from technology whitepapers to updates on the progress of defense programs.