Resonant to Present Research Papers on Innovative RF Filter Design Technology

Resonant has announced that it will present several papers and research findings at the International Ultrasonics Symposium (IUS), which will be held September 5 - 9, 2017 at the Omni Shoreham Hotel in Washington, DC.

They will present four new papers, which highlight innovative RF filter design technology. Two of these papers will be presented via displayed posters, and two via oral presentations. The four papers include:

  • Design and Characterization of SAW filters for High Power Performance (Poster) - Higher data-rates are driving the need to process higher powers in mobile phones. Combined with smaller filter footprints, this represents a significant challenge for mobile filters. This paper introduces novel design techniques to design for high power.
  • Parametric Study of the resonant TC-SAW Piston-mode Configurations (Poster) - TC-SAW is used to maintain the performance of mobile filters at low and high temperatures. However, the design of these structures is complex. This study shows how to design using TC-SAW and evaluates the performance of a difficult mid-band duplexer using this technique.
  • Acoustic Radiation from ends of IDT in Synchronous Resonators (Oral) - Dr. Victor Plessky, Resonant's Director of Engineering, will discuss how Finite Element Modeling is used to characterize the major loss mechanisms that impact filter performance for different resonator structures.
  • FEM modeling of an entire 5-IDT CRF/DMS Filter (Oral) - Dr. Plessky will discuss how smaller filter footprints require more complex 3D structures which are difficult to model, and therefore more difficult to design. He will show how a FEM model of complex multi-layer filter structures is useful in reducing filter size.

The IUS conference is organized by the Institute of Electrical and Electronics Engineers (IEEE) and is the premier annual forum for researchers to present new results and learn about recent advances in medical and industrial ultrasonics. Over a thousand scientists and engineers attended each of three recent symposia in Chicago (2014), Taipei (2015), and Tours (2016). The event consists of four days of events, including technical paper presentations, workshops and short courses. The symposium also includes the annual IEEE Ultrasonics Awards to recognize outstanding contributions in the field of ultrasonics.