EDI CON China 2018 is Now Accepting Abstract Submission

The EDICON China 2018 conference, intended to bring together engineers working on high-frequency analog and high-speed digital designs in China is scheduled to take place from March 20-22, 2018 at the China National Convention Center in Beijing.

In its sixth year, EDI CON China 2018 will include technical conference sessions as well as workshops, panels, keynotes, poster sessions and demonstrations from industry leading exhibitors in the RF, microwave and high-speed digital industries.

The conference is now accepting abstract submissions for the technical sessions to be held at the event. All submitted abstracts will be evaluated by the EDI CON Technical Advisory Committee for quality and educational relevance for conference attendees. The talks and presentations can be given in English, and the event will provide real-time transition into Chinese. (Talks can also be given in Chinese.)

Authors wishing to submit and abstract can do so here.