Indium Corporation to Exhibit Solder Paste for Fine Feature Printing at IWLPC 2017

Indium Corporation is set to exhibit its new 3.2HF Solder Paste at the 14th International Wafer-Level Packaging Conference (IWLPC 2017) from October 24-26, in San Jose.

The Indium 3.2HF Solder Paste is an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG). It is formulated to offer consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:

  • Good response-to-pause
  • A wide reflow profile window
  • Outstanding slump resistance
  • Excellent wetting capability
  • Superior fine-pitch soldering ability

From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.

Click here to know more about Indium3.2HF Solder Paste or Indium SiP products.

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