Ultra-thin Contactless Chip Module to Change the Way Passports & Identity Cards are Designed

NXP Semiconductors has unveiled a new, ultra-thin contactless chip module which will change the way passport and identity cards are designed. Measuring just 200 μm in thickness, the new MOB10 module is 20 percent thinner than its predecessor and is ideally suited for use in ultra-thin inlays of passport data pages and identity cards. It is the thinnest contactless module available in high volumes today and supports polycarbonate technology, along with new security and durability features.

NXP's MOB10 is the first ultra-thin platform designed to be compatible with existing production lines so manufacturers can add it without retooling; allowing them to support multiple products without increasing costs or slowing down production. The new ultra-thin chip module is designed to combat electronic document fraud by enabling slimmer and more secure eDatapages, eCovers and ID card inlays that are harder to forge or modify. The ultra-thin profile of 200 μm makes it possible to accommodate new security features and still include the secure microcontroller and its antenna without adding bulk to passports, national eID cards, eHealth cards, citizenship cards, resident cards, driver licenses, and smart cards.

For passports, the MOB10 allows the IC to be moved from the cover of the passport booklet to the personal data page inside the passport. This new feature offers additional security by preventing attempts to peel off or re-insert the IC after tampering. Additionally, it is designed to reduce micro-cracks, sustain mechanical and environmental stress, and is less susceptible to reverse-engineering or other security attacks. With an increased demand for slimmer solutions that can meet the future embedding requirements needed to produce thinner, and more cost-effective identity documents, the MOB10 is uniquely suited to answer this need and will empower a new generation of passports and ID cards that are thinner, more durable and even more secure than ever before.

The NXP chip module is also designed for high volume and offers higher density per reel. This feature optimizes machine throughput and storage space, so manufacturers of identity documents can reduce cost, operate more efficiently, and deliver more resilient end products. To ensure flexibility in implementation, the MOB10 solution is compatible with ICAO 9303 and ISO/IEC 14443 standards.