EDI CON USA 2018 Now Accepting Abstracts

The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the industry event that brings together RF/microwave and high-speed digital design engineers and system integrators, has called for Abstracts for EDI CON USA 2018. Selected papers will be presented at EDI CON USA 2018, held from October 17-19, 2018 at the Santa Clara Convention Center.

Track selections include RF & Microwave Design, Mobile Front End Design, Low Power RF & IoT, 5G Advanced Communications, Broadband Networks, Radar & Defense, Amplifier Design, Signal Integrity, Power Integrity, EMC/EMI, Simulation & Modeling, and Test & Measurement.

This year’s Technical Advisory Committee (TAC) is led by co-chairs Jin Bains, Head of Connectivity, SCL, at Facebook, and Ransom Stephens, Ph.D., author, technologist, and physicist. The EDI CON USA 2018 TAC will evaluate submitted abstracts based on quality, relevance, impact, and originality. To be accepted, submissions must be high quality and comprehensive, aimed at advancing the knowledge of attendees.

The Call for Abstracts closes May 3, 2018. Click here to learn more.