NXP Introduces Single Chip NFC Solution with eSIM Functionality

At MWC18, NXP Semiconductors announced significant advancements in GSMA-compliant eSIM solutions. These solutions make it easier for device manufacturers to bring consumers remote SIM provisioning and over-the-air updates with multiple Mobile Network Operator (MNO) subscriptions. With its latest chip innovations, NXP responds to the demands of the steadily growing eSIM market, which is projected to increase nearly seven-fold, from a relatively small base of 224 million shipments in 2018, to 696 million shipments by 2022, according to ABI Research (December 2017).

The new NXP SN100U is the world’s first, single-die chipset featuring an embedded Secure Element (SE), Near Field Communications (NFC), and eSIM for added advanced functionality, cellular connectivity, and security. The company also introduced the NXP SU070 standalone eSIM solution, which offers the industry’s smallest footprint and is ideal for smartphones, tablets, laptops, and other IoT devices that require cellular connectivity with low power consumption. Both new eSIM solutions feature the highest grade of end-to-end security from hardware-to-software, to offer safe, tamper-resistant data protection for consumers, Original Equipment Manufacturers (OEMs), MNOs and service providers.

SN100U - Highest Level of Integration

The highly-integrated SN100U chipset with SE, NFC, and eSIM is designed to make it easier and more cost-effective for OEMs to integrate demanding applications such as mobile transit, smart access control, contactless payments and increased platform security in future devices. With its multiple interfaces and secure software features, it is an exceptional choice for MNOs, OEMs and Original Design Manufacturers (ODMs) who do not want to choose between performance, standards compliance and security for new feature-rich devices. The SN100U also extends the life of such connected devices to the benefit of MNOs and their customers, with a significantly higher number of read / write cycles, multi-interface concurrency management, and significant savings in power consumption.

SU70 - Smallest Footprint & Power Consumption

Compared to existing solutions, both the SN100U and SU070 chipsets occupy up to 30 percent less surface on printed circuit boards, remove the need for a SIM port/door required by traditional SIM cards, and both enable exceptionally low power consumption. In particular, the SU070, ideal for wearables and other small connected mobile devices, offers a low-power feature mode that can reduce power consumption by up to 75 percent over competing eSIM solutions. Thanks to this flexibility, MNOs can explore more types of mobile cellular connected devices for their services.

Driving the convergence of eSIM and SE functionality, end users benefit from an even more convenient and secure lifestyle as they can, for example, stay on a call while making NFC mobile payments seamlessly in parallel.

NXP showcased the new eSIM solutions during the recently concluded Mobile World Conference (MWC 2018) event. The products are currently sampling with select customers.