Rogers to Exhibit Circuit Materials for 5G Wireless Applications at Upcoming Event

Rogers Corporation will be showcasing circuit materials with the characteristics needed for present and future high-frequency electronic circuit designs, including 5G wireless networks, at the upcoming Del Mar Electronic & Manufacturing Show from 2 - 3 May in San Diego, CA. The Del Mar Electronic & Manufacturing Show is a premier event for designers and manufacturers of consumer electronic products and services as well as technology-based products.

Representatives from Rogers will be at Booth #622 to offer advice and guidance on the optimum use of their circuit materials for many present and future high-frequency circuit designs, including RO4835T laminates, RO4450T Bonding Materials and CU4000 and CU4000 LoPro copper foils for forming thin, low-loss multilayer circuits, CLTE-MW laminates for microwave and millimeter-wave circuits in present and future communications devices, and RO4360G2 laminates for compact, low-cost power amplifiers in wireless base stations.

Visitors can learn more about low-loss materials for multilayer circuits, such as RO4835T laminates and RO4450T bonding materials. With the growing demand for complex high-frequency and high-speed circuits that must fit tight places, multilayer circuit constructions provide solutions in compact sizes. RO4835T laminates are low-loss, spread-glass-reinforced, ceramic-filled thermoset materials that serve as thin, high-performance inner circuit layers when used with Rogers RO4835 laminate, the RO4000 family of laminates, or with CU4000 or CU4000 LoPro foils when designers are looking for foil lamination builds.

RO4835T laminates, which are available in 2.5, 3, and 4 mil thicknesses, feature stable dielectric constant (Dk) of 3.3. When fabricating thin multilayer circuits, Rogers Corp.’s RO4450T Bonding Materials provide 3.2 to 3.3 Dk and low-loss characteristics to complement RO4835T, RO4835, and RO4000 laminates in forming reliable multilayer circuits compatible with FR-4 processing methods. Spread-glass-reinforced, ceramic-filled RO4450T bonding materials are available in 3, 4, and 5 mil thicknesses and, along with RO4835T laminates, are lead-free process compatible and feature the UL 94 V-0 flame-retardant rating.

For emerging 5G wireless networks and their use of added bandwidth at millimeter-wave frequencies of 24 GHz and higher, CLTE-MW laminates are available in seven thickness options from 3 to 10 mils for circuit designs limited in thickness due to mechanical or electrical requirements, including for PCB antenna arrays. These are ceramic-filled, woven-glass-reinforced PTFE composite materials with excellent dimensional stability and low Z-axis (thickness) coefficient of thermal expansion (CTE) of 30 ppm/ºC for reliable plated through holes.

Cost-effective CLTE-MW laminates have high filler loading to minimize glass-weave effects that can be detrimental at millimeter-wave frequencies. They feature low loss tangent of 0.0015 at 10 GHz, low moisture absorption of 0.03%, and thermal conductivity of 0.42 W/mK for effective dissipation of heat in high-power circuits. CLTE-MW laminates are available with a number of copper foil options, including rolled, reverse-treated ED, and standard ED copper. Resistive foil and metal plate options are also available upon request. These thin, high-frequency laminates also feature the UL 94 V-0 flame-retardant rating.  

Rogers will have other materials on display as well, including RO4360G2 laminates, formulated for power amplifier designers seeking enhanced thermal reliability in smaller circuit sizes. These low-loss glass-reinforced, ceramic-filled thermoset circuit materials process similar to FR-4 with low dissipation factor of 0.0038 and thermal conductivity of 0.75 W/mK well suited for power amplifier designs. RO4360G2 laminates exhibit a dielectric constant of 6.15 at 10 GHz in the z direction, tightly controlled within +/-0.15. Click here for more information.

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