StratEdge to Showcase High-Temperature and Reliability Packages at Upcoming Events

StratEdge Corporation, a leading high-performance semiconductor packages provider, is set to showcase its latest advancements at the upcoming IMAPS HiTEC Electronics and CS ManTech 2018 conferences.

The IMAPS HiTEC Electronics is scheduled from May 08 - 09 in Albuquerque, New Mexico; while the CS ManTech conference is being held from May 07 - 09 in Austin, Texas. On display at the events, will be StratEdge’s latest packaging technology for high-temperature applications, including Si, GaAs, and GaN devices, at HiTEC and the latest high-reliability package families at CS ManTech.

StratEdge designs and manufactures high-performance semiconductor packages and provides chip assembly and test services. They specialize in packages for high-frequency, very high power, extremely demanding Gallium Arsenide (GaAs) and Gallium Nitride (GaN) devices and have a complete line of post-fired and molded ceramic semiconductor packages that operate from DC to 50+ GHz. Their patented electrical transition designs packages exceptionally low electrical losses, even at 63+ GHz.

Having served markets including telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, and MEMS, the company believes that although their packages have been popular for their heat dissipating properties and high-reliability for over 20 years, but with a continued emphasis on lowering power and pushing the capabilities of chips to deliver ever-higher frequencies, these packages will become truly critical. Attending these shows would thus enable them to work with engineers to build packages that enable proper functioning of their chips.