NYU Tandon Wins Spot in DARPA Consortium to Jumpstart Wireless Innovation

While 5G wireless technologies and protocols are still in development, researchers at the NYU Tandon School of Engineering are reaching even further into the future as partners in ComSenTer, a newly formed hub for advanced wireless and sensing research founded by a consortium of industrial participants and the U.S. Defense Advanced Research Projects Agency (DARPA). ComSenTer is the latest initiative in the Joint University Microelectronics Program(JUMP), with $200 million of funding to accelerate innovation in microelectronics-based technologies, including wireless communications.

In a highly competitive selection process, NYU Tandon was chosen to join the lead institution - University of California, Santa Barbara - in this effort. Other researchers are from University of California, Berkeley; University of California, San Diego; Cornell University, and the Massachusetts Institute of Technology.

Sundeep Rangan, a professor of electrical and computer engineering at NYU Tandon and director of the research center NYU WIRELESS, will oversee New York University’s participation in ComSenTer. The NYU Tandon team will lead all the systems research, specifically developing end-to-end applications for high-speed communications and imaging systems. Their work is supported by a $1.9 million grant from Semiconductor Research Corporation (SRC).

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