SV Microwave Introduces High Frequency Stacked RF Board-to-Board Connection System

SV Microwave has introduced low stacked board-to-board RF connection system. The new high-frequency 3mm PCB interconnects have a low stacked height making them ideal for high density stacked and high density multiport applications. They can operate at frequencies up to 40 GHz.

3mm PCB Interconnect Key Specs:

  • Lowest stacked (3mm) board-to-board high-frequency connection system
  • 0.150" minimum pitch between adjacent connectors
  • Embedded Computing, 5G & IoT (Internet of Things)
  • DC - 40 GHz
  • Low-force, solderless installation does not damage PCB
  • Easy to assemble, solderless design reduces yield and assembly time
  • Lowest stacked height (3mm) of any board-to-board high frequency coaxial connection system

Applications for this connector system include, embedded computing, high density stacked PCB applications and also high density multiport applications. Click here to learn more about this product series.