ST's NFC Technology to Power TCL Communication’s New Smartphone

STMicroelectronics has revealed that its Near-Field Communication (NFC) technology is powering the contactless features of TCL Communication’s newly launched Alcatel 3V smartphone for the European market. Prioritizing enhanced user experience and convenience through Alcatel 3V’s NFC features, TCL Communication selected ST’s NFC-controller chip - ST21NFCD - for its unique technology that boosts RF performance without draining battery life.

ST’s technology ensures robust connectivity for fast and reliable contactless payments, e-ticket transactions, peer-to-peer data transfer, and emerging use cases including interacting with “physical-web” objects like smart posters or store-shelves. Superior RF performance also helped TCL Communication to streamline certification to mandatory stringent EMVCo, GSMA and NFC Forum standards for handsets.

The ST21NFCD integrates a complete NFC controller and RF circuitry that together meet NFC Forum type 1-5 tag specifications, ISO/IEC 18092 NFC Interface and Protocol (NFCIP), and RFID and payment standards including ISO 15693, ISO/IEC 14443 Type A & B, JIS X 6319 – 4 and MIFARE.

ST’s active load modulation technology leverages synchronization with the reader’s RF field to boost signal strength and ensure reliable coupling during data exchanges. This gives designers more flexibility to use smaller antenna sizes and minimize system power consumption for longer battery life, while enabling users to experience smooth, hassle-free contactless transactions.

The ST21NFCD contains many integrated features that minimize circuit size and bill-of-materials costs. These include a clock generator (with the option to use an external reference clock or quartz crystal), as well as on-chip power-management and battery-voltage monitoring that boost energy efficiency and extend run-time. Integrated eFlash with a secure firmware update mechanism also provides flexibility to apply upgrades and security packs over the air.

ST and TCL Communication aim to extend their collaboration to integrate ST’s hardware digital-security solutions into future TCL Communication products. ST has a portfolio of highly miniaturized, low-power chips, including an embedded Secure Element (eSE) for cryptography and key storage and combined NFC/eSE devices, which are certified to Common Criteria EAL5+ and EMVCo security standards for financial applications. ST also offers a wide range of solutions and form factors for eSIM.

Click here to learn more about the ST21NFCD from STMicroelectronics.

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