Ultra-low Transmission Loss Laminates for Semiconductor Packages and Modules

Panasonic has developed an ultra-low transmission loss circuit board material (Product No. Laminate R-G545L/R-G545E, Prepreg R-G540L/R-G540E) that is suitable for use in semiconductor packages and modules. The newly developed material allows the stable operation of semiconductor devices that process enormous data at a high speed.

Due to the expansion of IoT (Internet of Things) network and the launch of the fifth-generation (5G) mobile communications system scheduled to be implemented in 2020. It is expected that the data communication will become further larger in volume and faster. This circumstance has created a demand for circuit board materials used in semiconductor packages and modules that need to be adapted for high-speed/large-capacity data communication applications. From its original resin design technology, the company has developed the circuit board material with ultra-low transmission loss for semiconductor packages and modules.

Key Features:

  1. Ultra-low transmission loss that allows semiconductor devices to operate steadily
    • Transmission loss: -18.7 dB/m. Panasonic's conventional product: -20.6 dB/m (@20 GHz)
  2. Excellent environmental durability that allows semiconductor devices to operate over a long period
    • Stable electrical characteristics under a high-temperature/high-humidity conditions
    • When the developed material and a conventional product are left in an environment at 130°C with a relative humidity of 85% for 800 hours:
    • Variation in dissipation factor: 0.0024. Panasonic's conventional product: 0.0033
  3. Less warpage which contributes to an improvement in circuit board manufacturing yield
    • Warpage: 310 µm. Panasonic's conventional product: 410 µm

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