StratEdge to Display GaN and GaAs Packages at EDI CON USA

StratEdge Corporation will display its high-frequency, high-speed, thermally efficient packages at IMAPS, BCICTS, and EDI CON USA. StratEdge’s packages meet the extreme demands of gallium nitride (GaN) and gallium arsenide (GaAs) devices and the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS markets.

StratEdge will showcase two options for packaging GaN and high-power semiconductor devices, the LL family of leaded laminate copper-moly-copper (CMC) base packages and its off-the-shelf line of molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18 GHz. These packages dissipate heat and come in fully-hermetic versions in over 200 standard outlines.

StratEdge will also feature its complete line of post-fired and molded ceramic semiconductor packages operating from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies. All packages are lead-free and most meet RoHS and WEEE standards.

StratEdge will be exhibiting in booth 309 at the 2018 IMAPS Symposium on Microelectronics, which is being held October 9-11, 2018 at the Pasadena Convention Center in Pasadena, California. This year marks the 51st annual symposium for this microelectronics industry event.

At IEEE BiCMOS and Compound Integrated Circuits and Technology Symposium (BCICTS), which is being held October 14-17, 2018 at the Sheraton San Diego Hotel and Marina in San Diego, California, StratEdge will be exhibiting in booth 4. BCICTS is a new symposium that combines the former Compound Semiconductor IC Symposium (CSICS) with the Biploar/BiCMOS Circuit and Technology Meeting (BCTM).

At EDI CON USA 2018, being held at the Santa Clara Convention Center, Santa Clara, CA from October 17-18, 2018, StratEdge will be in booth 224. EDI CON USA is the first industry event in the USA to bring together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, product demonstrations, training, and learning opportunities.