Silver Jet Dispensing Capabilities Added to this Die Bonder for RF GaN Power Amplifiers

Automated microelectronic assembly machines expert, Palomar Technologies, has released new epoxy die attach capabilities for silver sintering. Developed to meet growing demands for RF GaN power amplifiers, which are a core requirement for the successful rollout of 5G networks around the world, the new silver jet dispensing capabilities are an enhancement to the already wide breadth of Palomar Technologies solutions for the telecom/Datacom markets.

With the launch of 5G networks powering Smart Cities around the world, an explosion of growth has been seen in the development of RF GaN power amplifiers. According to market research firm Yole Development, the RF GaN device market is expected to grow from $380 million in 2017 to $1.3 billion by 2023. Silver sintering for power electronics offers the ability to deliver with high thermal and electrical conductivities, low process temperature and high reliability while in production greatly reducing cycle time, thereby reducing costs for the development of RF GaN device packages.

According to Rich Hueners, Global Vice President of Sales for Palomar Technologies, high power RF packaging and assembly anchor processes rest with automated die bonders capable of high-speed GaN silver sintering dispense and high throughput of GaN AuSn eutectic assembly -- critical to realizing full commercialization for 5G. Providing this capability has been a focus for Palomar and they are thus pleased to be able to offer this to customers around the world.

Advantages of Jet Dispensing:

  • Pinpoint Shooting with flexible dispensing from below, side or oblique directions, it provides effective applications on uneven/narrow areas to which the normal nozzle is not accessible.
  • High-Speed Processing possible without being affected by curves or individual differences in work pieces provides high-precision, stable dispensing of microscopic dots.
  • Cost Reduction opportunities gained through less material waste and increased throughput.

Applications:

  • Jetting silver paste to lead frames
  • Conformal coating for automotive PCB
  • Jetting UV glue
  • Adhesion/bonding of various electronic parts
  • Dotting, lining, coating and more

The new jet dispensing capabilities are currently available for the Palomar 3880 Die Bonder.