MACOM to Exhibit RF Solutions for 5G Connectivity and Base Stations at EDICON China

MACOM will showcase its broad high-performance RF portfolio of industry-leading MMICs, diodes, AlGaAs switches, power amplifiers, FEMs and GaN devices, at the upcoming EDICON China 2019 event. EDI CON China 2019 event will bring together Chinese RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities in the field of electronic design innovations.

MACOM’s booth will feature new product solutions optimized for 5G connectivity, wireless base stations, radar, test and measurement, industrial, scientific and medical RF applications.

At EDICON China MACOM will showcase the following:

  • High-Performance RF Components: Showcasing MACOM’s high-performance portfolio serving diverse markets, test, and measurement, satellite, radar, wired and wireless networks, automotive, industrial, medical and mobile devices
  • 5G Connectivity Solution : Complete portfolio of high-performance and reliability wireless access front-end components and modules for 4G/5G
  • Solution for Next Generation of Wireless Basestations: Cutting-edge GaN-on-Si 60W average Power Doherty module
  • RF Energy: MACOM’s GaN-on-Si portfolio delivers the performance, scale, supply security and surge capacity required for mainstream RF applications
  • Application Support: MACOM’s unparalleled customer support leverages decades of experience to solve complex problems
  • Cross Reference Tools: MACOM’s cross-reference tools will assist in finding MACOM products that are a substitute or alternate replacement to other manufacturers

MACOM experts will also participate in the following panel during EDICON China:

  • State of GaN Technology Panel with MACOM’s Echo Cheng
  • Time: Tuesday, April 2nd, 2:35-4:00 PM
  • Location: Room 206
  • Session Number: T9-8
  • About: Semiconductor foundry and device manufacturers will review and debate the state of GaN manufacturing, covering topics such as reliability, advanced heat dissipation techniques, new packing innovations, Si versus SiC substrates, mmWave GaN devices, the use of GaN for various device types and the state of GaN semiconductor production in China.

Click here for more information on EDICON China 2019.


  • Country: United States
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