World's First Dual Polarization AiP Package Solution for 5G mm-Wave Applications

SJ Semiconductor has released the first 5G mm-Wave ultra-wideband dual polarization AiP (Antenna in Package) technology called SmartAiP. Antenna-in-package (AiP) technology is the implementation of an antenna and a radio into a standard surface-mounted package.

The SmartAiP technology developed by SJ Semiconductors is ideal for the 5G mm-Wave applications. It operates across a wide frequency range from 24 to 43 GHz with a gain of 12.5 dB (which is about 4x of what existing solutions provide). The solution also has a handset friendly form factor which is less than 1 mm in thickness and still has room for RFFE module integration with good at heat dissipation.

Along with the well designed antenna and transceiver provided by Speed Wireless Technology, the SmartAiP shows its low power loss advantage across a frequency range from 24 to 43 GHz covering 5G mm-Wave bands for almost all countries.

The rollout of the SmartAiP will close the gap of the integration of the antenna, RFFE module and transceiver to foster the commercialization of the 5G mm-Wave. This marks the crucial contribution from the advanced package industry by its novel process and package structure inventions for the 5G mm-Wave in light of the post-Moore's law era.

SJSemi's novel, patented SmartAiP technology enables 3D integration of the active and passives devices. This 3D integration leads to lower power delivery loss and higher performance per watt. Its key enabling technologies comprise of ultra-high Cu vertical interconnect, multi-layer double-sided fine pitch RDLs, wafer-level multi-layer precise aligned antennas, flip-chip, and SMT. These technologies empower the full integration of the 5G antennas, RFFE modules and transceivers within a small form factor in less than 1mm thickness. SmartAiP's low power consumption, slim form factor, and high gain are tailor-fits to the 5G mm-Wave handsets besides the HVM proven wafer fab streamline and its simplified supply chain compared to current solutions on the market.

3D-IC is one of the main focus on SJSemi's technology roadmap from the beginning. SmartAiP is derived from SJSemi's 3D-SiP platform-SmartPoser which SJSemi has invented, developed for years and applied to the 5G mm-Wave market for the first time. Its unprecedented and encouraging performance paves the way to further into 3D-IC technology for the SJSemi. Based on this superior SmartAiP technology, they will co-work with partners to accelerate and capitalize on the application of the 5G mm-Wave. SJSemi will be at full steam to prepare for high volume production to meet the ever-growing market demands from the 5G mm-Wave.

Click here to learn more about SJ Semiconductor.

Featured Product