Infineon to Expand 77 GHz Automotive Radar Chip R&D Facility

In a bid to strengthen its R&D efforts for high-frequency components, Infineon has expanded its manufacturing division in Linz, Austria. The Infineon Austria holding company DICE (Danube Integrated Circuit Engineering) expects to have a new building up and running by the summer of 2020. The building will provide room for about 400 employees – creating the possibility of 220 new jobs as they currently employ 180 employees in their existing facility. The main focus of this center will be the development of 77 GHz radar chips for driver assistance systems.

The Linz site develops solutions for important future markets. According to Peter Schiefer, President of the Automotive Division of the Infineon Group, Infineon is shaping the future of mobility and communication. Microelectronics accounts for the majority of all innovations in the car and in the smartphone. The further development of advanced driver assistance systems, smartphones, tablets and navigation devices is a powerful driver of growth for Infineon. And the semiconductor solutions for all of this are developed in Linz among other locations.

As one of the leading research-focused industrial companies in Austria, Infineon’s site in Linz is continuously focusing on the expansion of local expertise and global research tasks in the future-oriented field of high-frequency technology. The local education institutions and research players provide a strong regional knowledge environment that enables outstanding innovations.

Infineon is a pioneer in radar for driver assistance systems. In 2009, they launched the world's first 77 GHz radar chip that uses silicon-germanium technology. With more than 100 million 77 GHz radar chips sold, Infineon is the technology and world market leader in this segment. The aim is to develop this safety technology further. Radar sensors will be part of the standard equipment of every new car in the future. Among other things, they are also required for autonomous driving.