Indium Corporation to Present Void Reduction Techniques at IMS 2019

Seth Homer, Product Manager of Engineered Solders at Indium Corporation will present Materials and Techniques for Void Reduction Under Bottom Termination Components at IMS 2019.

The paper discusses how voiding is challenging demands for increased reliability and performance, especially as the industry moves toward new 5G platforms. As a solution to excessive voiding between the thermal pad on the QFN and PWB pad, he examines how Indium Corporation’s flux-coated solder preforms have been used to significantly reduce voiding while providing extra benefits to enhance final product reliability.

Homer has worked with Indium Corporation for more than 25 years, serving in both manufacturing operations and marketing roles. He is responsible for many of the products within the engineered solders product offering especially as it relates to the IGBT and power electronics industries. He travels to customer sites globally to gain industry insight and works closely with Indium Corporation’s manufacturing teams to help support current production demand and future product development.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil.

The International Microwave Symposium (IMS) 2019 will take place in Boston from June 2-7. Click here to see everything RF's coverage of the event.