Novel Flexible & Electrically-Conductive Silicone Adhesive for EMC Applications

Dow has introduced new DOWSIL EC-6601 Electrically Conductive Adhesive, a next-generation material engineered to provide reliable performance and electromagnetic compatibility (EMC) in demanding electrical and electronics applications in the transportation, communications and consumer markets at The Battery Show Europe 2019. This novel adhesive combines strong electromagnetic interference (EMI) shielding capabilities across a wide range of frequencies with durable mechanical and conductive properties over time, underscoring how Dow is further growing its highly differentiated EMI shielding solutions portfolio.

The new DOWSIL EC-6601 Electrically Conductive Adhesive provides a strong adhesive with stable EMI shielding across a broad frequency range along with with long-lasting mechanical and electrical performance, and the ability to bond to a variety of substrates. 

It is uniquely formulated to form strong bonds to many substrates and has greater than 150 percent elongation to enable flexibility at the joints. With its longer shelf life, better material strength, increased flexibility, stronger adhesion, and greater electrical conductivity, this innovative new adhesive provides key advantages over other conductive elastomers, a category of materials that are used widely in today’s printed circuit board and advanced systems assembly market.

In the transportation industry, for example, the electrification of vehicles is driving increased demand for greater connectivity, reliability and compliance with tight safety regulations that require high-performance EMI shielding. Applications such as electronic control units (ECU), cameras, radar, LiDAR, sensors and batteries all need dependable performance over time with zero defects. The new vehicle architectures for autonomous vehicles are also raising the bar for EMI shielding because of their many sensor configurations.

In the communications space, 5G base stations and optical interconnects that need greater data transfers at faster speeds are challenging EMC experts. Consumer electronics with high-density packaging and smart architectures are also susceptible to electronic pollution that can disrupt or disable circuits. DOWSIL™ EC-6601 Electrically Conductive Adhesive provides the stable EMI shielding that is required for these and other applications while maintaining its properties and electrical conductivity.

The DOWSIL EC-6601 Electrically Conductive Adhesive can be used as adhesive, formed-in-place gaskets (FIPG), or cure-in-place gaskets (CIPG). This silicone elastomer has an optimized dispense rate and withstands high temperatures, humidity, vibration, compression, and tensile stress. With its high elongation, the material can stretch to support the movement of a joint when used as an adhesive, FIPG or CIPG. DOWSIL EC-6601 Electrically Conductive Adhesive contains premium fillers and provides excellent corrosion resistance.

Dow’s portfolio of performance materials, industrial intermediates and plastics businesses delivers a broad range of differentiated science-based products and solutions for our customers in high-growth segments, such as packaging, infrastructure and consumer care.

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