Benchmark to Showcase Advanced RF Components for mm-Wave Applications at IMS 2019

Advanced RF manufacturing company, Benchmark Electronics, along with its subsidiary, Lark RF Technology, will be exhibiting at the IEEE-MTTS IMS 2019 event being held in Boston from June 4-6. At the event, Benchmark will showcase its advanced manufacturing processes and ability to design and build the best RF solutions for complex, highly regulated markets such as aerospace and defense.

Benchmark combines all of its capabilities to offer design for excellence, size, weight and power optimization, processes and building blocks that increases an OEM’s ability to achieve requirements in a shorter time to market. The company is driving innovation for critical industry needs such as miniaturization, computing power, communication optimization and sensor integration.

Benchmark’s cutting-edge solutions on display at IMS will include:

  • Leading Liquid Crystal Polymer (LCP) technology for miniaturizing product design, including avionic and mission control systems.
  • Printed circuit board designs with embedded cooling for temperature stabilization in a densely packed electronic environment.
  • RF components for millimeter wave applications (5G) utilizing the latest advances in circuit fabrication technology and high frequency materials.
  • High Density Interconnect (HDI) fabrication technology, including sub 25 micron feature sizes achieved by semi-additive processes.
  • Micro-electronics and mixed technology capabilities in engineering and manufacturing.

Both the companies (Benchmark & Lark RF Technology) will be exhibiting at the event from June 4-6 in Booth #1230 at the Boston Convention & Exhibition Center in Boston, MA.

Click here to view everything RF's complete coverage of IMS 2019.