Unex & STMicro Help Developers Reduce Time-to-Market for V2X Solutions

Leading V2X (Vehicle-to-Everything) systems provider, Unex, has announced the integration of its most flexible and cyber-secure V2X System-on-Module, SOM-301, on STMicroelectronics’ Telemaco3P Modular Telematics Platform (TC3P-MTP). The integration, according to the companies, will provide partners and customers with an easier time-to-market of V2X solutions. The joint effort aims to accelerate the adoption of next-generation systems for autonomous and safer connected cars.

Unex’s SOM-301 is a self-contained System-on-Module that integrates all V2X essential hardware and software components and features Unex’s V2Xcast technology. SOM-301 devices integrate ST’s Teseo III automotive multi-constellation GNSS chip and Autotalks’ state-of-the-art CRATON2/PLUTON2 – global and truly secure V2X chipset, capable of both DSRC and C-V2X (PC5) connectivity.

ST’s Telemaco3P Modular Telematics Platform provides an open development environment for prototyping advanced Smart Driving applications. At its core is the Telemaco3P secure automotive processor, the industry’s first device with an embedded isolated Hardware Security Module for state-of-the-art security. The platform provides positioning hardware with ST’s automotive-grade multi-constellation GNSS Teseo IC and dead-reckoning sensors. It also offers direct connectivity to automotive buses such as CAN-FD, FlexRay, and BroadR-Reach (100Base-T1), as well as optional modules for Bluetooth, Wi-Fi, and LTE.

Unex’s V2Xcast software stack enables extended capabilities for the V2X processing; the CRATON2 on SOM-301 handles secure V2X communication on one side, while the Telemaco3P manages the applications, fusing the V2X messages with data from in-vehicle, Wi-Fi, or cellular networks. The integration of the SOM-301 onto ST’s Telemaco3P Modular Telematics Platform results in a solution that can easily be customized at both hardware and software levels, enabling near-final V2V and V2I applications prototyping and shortening time to market.

STMicroelectronics is showcasing the Telemaco3P Modular Telematics Platform with the Unex V2X System-on-Module at MWC Shanghai 2019 from June 26-28 at Booth N1.D85.

Click here to know more about V2X on Telemaco3P and SOM-301.