Rogers Corporation will be showcasing its latest high-performance circuit materials at the upcoming PCB West 2019 event being held in Santa Clara, CA on 10th September. The PCB West Conference and Exhibition is one of the electronic industry’s major events for PCB design, fabrication and assembly.
At the event Rogers’ Technical Marketing Manager, John Coonrod, will be presenting “An Overview of Glass-Weave Effect for PCB-Based RF and High-Speed Digital Applications” on Tuesday, September 10, from 2:00 pm. to 3:00 p.m. during the free sessions. This presentation will include an overview of basic PCB properties in which the glass-weave effect can be influential and give examples from multiple studies which evaluated the glass-weave effect.
At their Booth Rogers will be showcasing the following:
RO4835T/RO4835 Laminates, RO4450T Bonding Materials
The RO4835T laminates, offered in a 2.5 mil, 3 mil and 4 mil core thickness, are low loss, 3.3 Dk, spread glass reinforced, ceramic-filled thermoset materials designed for inner-layer use in multilayer board designs, and complement RO4835 laminates when thinner cores are needed. RO4450T low loss, 3.2-3.3 Dk, spread glass reinforced, ceramic-filled bonding materials were designed to complement RO4835T and the existing RO4000 laminate family, and come in 3 mil, 4 mil or 5 mil thicknesses.
The laminates and the bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through-hole reliability, and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully-cured RO4000 products are capable of withstanding multiple lamination cycles. The RO4835T laminates and RO4450T bonding materials have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.
Xtreme Speed RO1200 High Speed, Extremely Low Loss Laminates
As the demand for faster and more data drives channel speeds of core network infrastructure to 112 Gbps, one of the limiting factors in increasing performance is the signal attenuation resulting from the circuit materials.
Network equipment designers need high performance circuit materials with superior electrical properties for applications like IP Infrastructure, High Performance Computing, and Test and Measurement. XtremeSpeed RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high speed designs. The materials enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications.
With a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 @10 GHz, the RO1200 laminates provide outstanding signal integrity, reduced signal skew, and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen free UL 94 V-0 rating, they are well suited for the most demanding high layer count applications.
RO3003G2 high frequency laminates build on Rogers’ industry-leading RO3003 platform to provide radar sensor designers with improved insertion loss and reduced Dk variation. The combination of Rogers’ optimized resin and filler content along with the introduction of very low-profile ED copper translates to Dk of 3.00 @ 10 GHz (clamped stripline method) and 3.07 @ 77 GHz (microstrip differential phase length method). The laminates also show very low insertion loss of 1.3dB/inch for 5 mil laminates as measured by the microstrip differential phase length method.
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