Quectel Releases New 5G-Enabled Automotive Modules at CES 2020

At CES 2020, Quectel Wireless Solutions has announced the release of a new series of communication modules targeting the 5G connected car sector. The new automotive-grade modules include the AG550Q, a new 5G New Radio (5G NR) Sub-6 GHz module, the AG215S automotive EAP module, for C-V2X scenarios, and the AF50T Wi-Fi module. All three modules are based on Qualcomm Automotive Wireless Solutions.

The modules are designed to provide multi-gigabit cloud connectivity, improved location services, and enhanced security to support the increasing requirements of connected cars and autonomous driving use cases. The AG550Q 5G NR module, supporting both NSA and SA modes, is based on the AEC-Q100 qualified Qualcomm Snapdragon Automotive 5G Platform. The module is compliant with IATF 16949 requirements, and follows automotive quality processes such as APQP and PPAP to address the demanding requirements of automotive devices.

Adopting the 3GPP Rel. 15 technology, the AG550Q supports high speeds and ultra-low latency to facilitate better security and quality-of-service for mission-critical services. The multimode 5G NR module is backward compatible with existing 4G, 3G and 2G technologies. This ensures that cars will remain connected regardless of where they travel within the network. Supporting optional C-V2X PC5 direct communications, the module provides superior performance in vehicle-to-vehicle (V2V) and vehicle-to-roadside infrastructure (V2I) communications for improved traffic efficiency and safety. Furthermore, the module supports optional Dual SIM Dual Activation (DSDA), which allows the car and driver to each choose their own independent network operator subscription in order to support a variety of emerging mobility service models.

Additionally, the module also supports multi-constellation and multi-frequency GNSS (L1/L2/L5), as well as optional Qualcomm Dead Reckoning (QDR) 3.0 technology which provides quick and highly accurate location positioning. The module will be commonly found in telematics boxes (T-Box), telematics control units (TCU), advanced driver-assistance systems (ADAS), C-V2X (V2V, V2I, V2P) systems, on-board units (OBU), roadside units (RSU), and other automotive/traffic systems.

The AG550Q has powerful Cyber Security features, which include firmware secure boot, Trusted Execution Environment (TEE), network firewall, SELinux strong access control, TLS/SSL security protocols and more.

Besides the AG550Q, Quectel also unveiled an automotive EAP module AG215S at the show, which has been created for C-V2X applications, and features the Qualcomm Snapdragon 2150 platform. The module integrates a powerful application processor to host ITS stack and applications. Along with having a hardware crypto engine embedded to fulfill powerful ECDSA verification capability (with support for up to 2500 verifications/sec). The AG215S supports the global, US, EU and China National Security Algorithm, which can greatly boost security in vehicle communications. Quectel will also provide the reference design platform with full functionality (Application Processor + Modem + Connectivity + GNSS + SW SDKs), for customers and application developers.

The third newly released module, the AF50T Wi-Fi module targets the connected car sector and supports Wi-Fi 2.4GHz + 5 GHz & BT 5.1, and 802.11a/b/g/n/ac/ax standards.

The AG550Q module is currently in the engineering sample stage, with the evaluation board available to reduce development time for OEMs and Tier 1 suppliers; while the AG215S module will be sampling starting January 2020. All three modules are being showcased at Quectel’s booth No. 2601 at CES 2020.

Click here to view our coverage of the CES 2020 event taking place from January 7-10 in Las Vegas, Nevada, US.