The DesignCon 2019 event will offer an in-depth, three-day conference program curated by the event’s Technical Program Committee (TPC) — an expert panel of more than 90 industry professionals. With over 100 technical paper sessions, panels, and tutorials spanning 14 tracks, DesignCon's educational content will cover all aspects of electronic design, including signal and power integrity; system co-design; and test and measurement methodologies. The event will bring together 5,000 professionals from the high-speed communications and semiconductor communities for three jam-packed days of education and activities. Through an in-depth conference program and expo showcase, the event will offer state-of-the-art design methodologies, applications, technologies, and unparalleled networking opportunities. New this year, the Institute of Electrical and Electronics Engineers (IEEE) will offer its valuable accreditation to all-access and two-day conference pass holders.