EDI CON 2013 – Electronic Design Innovation Conference

  • Date: March 12-14, 2013
  • Location:
    Beijing, China
  • Event Type: Confrences,Tradeshows & Conventions

Event Overview

EDI CON is an opportunity for design engineers and system integrators to learn about the latest RF/Microwave and high-speed digital products, design tools and technologies for today's communication, computing, RFID, industrial wireless monitoring, navigation, aerospace and related markets. A focus on enhancing physical design, emerging technologies and practical engineering solutions, brings together designers at the forefront of Chinese innovation and the world's leading technology companies.