Rogers Corporation, a global leader in engineered materials, will be showcasing its latest 5G and Autonomous Vehicle materials and other products at the upcoming IMS 2021 event taking place from June 08-09. At its Booth #1621, Rogers will showcase its products including XtremeSpeed™ RO1200™ laminates and bondplies, RT/duroid® 6035HTC laminates, as well as the recently launched SpeedWave™ 300P ultra-low loss prepreg.
In addition, John Coonrod, Rogers’ Technical Marketing Manager, will also be presenting a technical presentation on “Thermal Management for High-Frequency PCBs” from 11:45 – 12:00 p.m. on Tue., June 8 and “Stripline Circuitry for Millimeter-Wave and Very High-Speed Digital” from 11:15 – 11:30 p.m. on Wed., June 9 in the MicroApps Theater at the International Microwave Symposium (IMS) in Atlanta.
Rogers’ XtremeSpeed™ RO1200™ circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high-speed designs. These circuit materials enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications. With a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 @10 GHz, XtremeSpeed RO1200 materials provide outstanding signal integrity, reduced signal skew, and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen free UL 94 V-0 rating, these materials are well suited for the most demanding high layer count applications.
The RT/duroid® 6035HTC laminates feature a relative dielectric constant of 3.5 at 10 GHz, making them suitable for a wide range of circuits, including amplifiers, couplers, filters, and power combiners/dividers employed in avionic and other military and hi-reliability systems. The laminates incorporate a unique filler material to achieve superior heat-transfer characteristics compared to other high frequency circuit materials with similar dielectric constant. With outstanding thermal conductivity of 1.44 W/m·K as well as low loss, with a loss tangent of 0.0013 at 10 GHz, for excellent high frequency performance, this combination of high thermal conductivity and low dielectric loss translates into improved amplifier performance.
The SpeedWave™ 300P prepreg provides excellent thermal reliability for the most demanding high layer count designs requiring multiple sequential laminations. It also delivers superior fill and flow capability around heavy copper features, a low z-axis expansion for plated through-hole reliability and is CAF resistant. This UL 94 V-0 rated material is compatible with modified FR-4 fabrication processes and lead-free PCB assembly processing and is ideal for 5G mmWave, high resolution 77 GHz automotive radar, aerospace & defense and high-speed digital designs.
IMS 2021, this year, will be held in both a physical as well as virtual format. The event is scheduled to take place from June 7-9, 2021 (In-Person / Physical) and June 20-25, 2021 (Virtually).