Times Microwave Systems has introduced Low PIM Xpress Assemblies for quick 5G deployment and bandwidth expansions. The Low PIM Xpress program ensures a fast delivery time of one week or less for these essential system components.
Short for passive intermodulation, PIM is a type of distortion/noise generated by two or more high power signals interacting with non-linear characteristics in the RF path. Essentially, when two or more high power frequencies exist on the same RF interconnect, there is the chance to form additional frequencies which will raise the noise floor.
In the telecom industry, it is relatively standard to test for the magnitude of the 3rd harmonic created by the placement of two 20-watt signals onto the RF interconnect. A PIM level requirement of -153 dBc or better is fairly standard in the industry. Times Microwave Systems design and test their low PIM jumpers to perform to -160 dBc or better.
While PIM is an issue for almost every wireless system, it is more noticeable in cellular applications such as 5G because the frequency bands used are very close to each other. PIM can create interference that limits receive sensitivity, lowering the cellular system’s reliability, data rate, and capacity. Passive intermodulation issues can result in decreased system capacity and data rates and dropped calls.
Network densification is crucial to 5G – more small cells and DAS networks are needed in more locations to support such high speeds with high RF performance, low PIM and good shielding. Times Microwave uses their experience in building mission-critical, high-end assemblies to provide the highest-quality products for users with unparalleled support and turnaround.
Click here for more details on the Low PIM Xpress Assemblies.
Click here to learn more about Passive Intermodulation (PIM).