StratEdge Corporation, a leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, is displaying its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 4089 at the International Microwave Symposium (IMS), being held in Denver, CO, from June 21-23.
StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, and down-hole.
“We manufacture our packages to exacting specifications, using post-fired ceramics with features that are laser cut to control tight tolerances, thermally-enhanced metal bases that dissipate heat, and electrical transition designs that provide exceptionally low electrical losses. To further ensure optimized performance, StratEdge Assembly Services can package your devices in our new cleanroom, which is equipped with the latest precision wire bonding and die attach systems.” said Casey Krawiec, VP of global sales at StratEdge.
Stop by the StratEdge Booth at IMS 2022 to discuss your high-frequency, high-power packaging needs in person.
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