Modelithics has announced the release of several new models for components from Smiths Interconnect. The new models include a Microwave Global Model for the TSX Series of surface-mount attenuators and new substrate-independent models for the CTX Series (CTH0603ALN1SMTF, CT0404ALN1WB1, and CT0404ALN2WB1) of high-frequency wire bondable chip terminations. The new models are available within the Modelithics COMPLETE Library as well as the Modelithics mmWave & 5G Library.
The TSX Series of attenuators offer excellent broadband RF performance while delivering increased power handling in a small surface mount format factor. It includes attenuation values from 0 to 10 dB in 1-dB increments, 15 dB, and 20 dB, which are all included in the new model. In addition, the new model for the TSX series is validated from DC to 60 GHz. It also provides validated data for a range of substrates.
The CTH0603ALN1SMTF model of the CTX Series is a surface-mountable 50-Ω chip termination that can handle as much as 1 W of CW input power. The new model for this termination is validated from DC to 67 GHz. The model is also substrate scalable.
Lastly, the CT0404ALN1WB1 and CT0404ALN2WB1 models of the CTX Series are wire-bondable 50-Ω chip terminations. The new model for the CT0404ALN1WB1 termination is validated from DC to 60 GHz, while the model for the CT0404ALN2WB1 termination is validated from DC to 67 GHz. Both models are substrate-independent. The Modelithics COMPLETE Library and the mmWave & 5G Library are available for Keysight Technologies’ PathWave Advanced Design System (ADS), Keysight Technologies’ PathWave RF Synthesis (Genesys), Cadence® AWR Design Environment, Cadence Spectre Simulation Platform, Ansys HFSS, and Sonnet Suites.
The Modelithics Vendor Partner (MVP) Program offers FREE 90-day trials of all Modelithics models for Smiths Interconnect components.
Click here to learn more about the TSK Series of attenuators Smiths Interconnect.
Click here to learn more about CTX series of terminations of Smiths Interconnect.