Fibocom, a designer and manufacturer of IoT (Internet of Things) wireless solutions and wireless communication modules, announced the FG370 FWA-dedicated 5G module at the Broadband World Forum 2022 in Amsterdam earlier this month.
The 5G module is powered by the newly-launched MediaTek T830 platform, FG370 is set to bring an enhanced mobile broadband, low latency, and ultra-reliable 5G Fixed Wireless Access (FWA) connectivity solution for global operators.
Compliant with 3GPP Release 16 (R16) standards, the 5G Sub-6 GHz module FG370 enables lightning-fast 5G speed experiences with up to 7.01 Gbps on the downlink and 2.5 Gbps on the uplink theoretically. Available with a quad-core Arm Cortex-A55 CPU, FG370 supports 4CC CA (Carrier Aggregation) and up to 300 MHz of spectrum, as well as 2CC CA and up to 200 MHz of spectrum, which improves the utilization of spectrum resources and ensures extended 5G coverage. Supporting 5G standalone network (SA) and non-standalone (NSA) network architectures, the module is also backward compatible with LTE-TDD, LTE-FDD and WCDMA network standards.
In addition, FG370 supports 8RX (Receive Antennas), enhancing downlink speeds, spectral efficiency and coverage quality. The module also supports Power Class 1.5 (PC1.5) High Power User Equipment (HPUE), which allows a maximum transmit power of up to 29 dBm, 6 dB higher than that of PC3, and 3 dB higher than that of PC2, significantly increasing uplink speed and extending uplink coverage. With enhancements in terms of uplink and downlink speed and coverage, FG370 can provide a better user experience while offering seamless 5G connectivity for FWA.
It is worth noting that, FG370 can support enhanced connectivity solutions, including Dual-band 2×2 Wi-Fi 7 for MiFi (BE6500) and Tri-band 4×4 Wi-Fi 7 for CPE (BE19000). These solutions feature new Wi-Fi 7 capabilities such as 160 MHz/ 320 MHz bandwidth, 6 GHz frequency band, 4096-QAM, as well as Multi-Link Operation (MLO). The module also supports wired network deployment, allowing maximum 10Gb Ethernet, satisfying different application requirements.
With a rich extension of interfaces including 10GbE USXGMII/ PCI-Express/ USB 3.2, plus PCM/SPI for connection to external SLIC for RJ11 phone ports, FG370 seamlessly enables a wide range of IoT applications, providing high-speed 5G experience for customers. The module also integrates MediaTek’s 5G UltraSave technologies to optimize energy efficiency for 5G connections, especially 5G MiFi.
“Fibocom is pleased to work with MediaTek to contribute to the proliferation of 5G,” said Simon Tao, General Manager of MBB Product Management Dept., Fibocom. “We’re delighted to introduce the new generation of 5G module FG370 to the global FWA market, further boosting 5G commercialization with enhanced coverage, increasing throughput as well as optimized capacity.”
Click here to learn more about Fibocom's 5G modules.