Quectel Wireless Solutions, a global IoT solutions provider, showcased its middleware solution for Dual SIM Service at MWC Barcelona utilizing the Qualcomm telematics software framework. This framework provides access to next-generation connectivity and telematics solutions based on Qualcomm Technologies, Inc.’s extensive expertise in 5G, C-V2X, location, telematics, automotive, functional safety, hypervisors, and security.
Dual SIM Service enables applications to steer data traffic utilizing the dual SIM connectivity based on OEM choice of carrier, Quality of Service (QoS), and billing. The demonstration features a Snapdragon Auto Modem-RF chipset from Qualcomm Technologies, with a Quectel module AG-553-EU, highlighting the use of Dual SIM Service on telematics software from Qualcomm Technologies.
“We’re pleased to be demonstrating the Dual SIM service at MWC Barcelona with Qualcomm,” said Manfred Lindacher, VP Sales Automotive International, Quectel Wireless Solutions. “It underlines our commitment to providing global automotive OEMs and Tier One suppliers with the most advanced connectivity options available, enabling them to tackle the issues of low connectivity with dual sims in their applications.”
“The Dual SIM Service demonstration at MWC Barcelona showcases the close collaboration we have with Quectel,” said An Chen, Vice President, Engineering, Qualcomm Incorporated.
The Technology Value Added Services (Tech VAS) program, developed by Qualcomm’s Qualcomm Technology Licensing (QTL) division helps enable advanced technology solutions to be optimized on Qualcomm hardware platforms. As part of the Tech VAS program, the Dual SIM Service feature will be made available through a software package that will improve vehicle connectivity, throughput, and reliability.
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