Doosan Corporation Electro-Materials, a specialist in electro-materials and a business group of Doosan, will showcase its latest 5G products and technologies along with other substrate solutions at the IMS 2023 event. These products are aimed at bringing a “Delightful Life” to customers in the era of 5G and beyond. This exhibition is North America’s largest Microwave/RF trade show that will be held in San Diego from June 13 to 15. The company will highlight 5G mmWave antenna modules, a MEMS timing solution, and copper clad laminates (CCL) for ‘high-speed & high-frequency’ applications.
The company introduced its first 5G mmWave 28 GHz beamforming antenna module (n257: 25.5~29.5 GHz) in 2022 and has started mass production. Additionally, the 26 GHz version was launched in the same year. These modules are crucial for 5G wireless repeaters or small cells, based on Movandi BeamX beamforming antenna technology. They offer integrated solutions for signal transmission, reception, and frequency conversion. The company is promoting the antenna modules not only in Korea but also in overseas markets like Japan and Australia. It is also developing 39 GHz antenna modules in collaboration with Movandi. The company is getting new 5G-related business opportunities through its 5G mmWave antenna module business.
Doosan Corporation Electro-Materials, in partnership with Canadian company Stathera, is developing MEMS timing solution designed for wearable, IoT, and smartphones. This one true-dual-output (MHz and kHz) MEMS oscillator can replace two single-output oscillators, allowing customers to overcome PCB design limitations while reducing energy consumption, PCB board-space, and even BOM costs. With its wide range of applications, you can learn more about MEMS timing solution, technology, advantages, and benefits to customers at Doosan Corporation Electro-Materials’ booth.
Doosan Corporation Electro-Materials is a global provider of copper-clad laminates (CCL), a base material of printed circuit board (PCB), for various applications including 5G/6G communications infrastructures, automotive electronics, and semiconductors. With 50 years of industry experience and accumulated technologies, the company will present materials suitable for high-frequency communications with low Dk/Df characteristics. Additionally, it will exhibit Polytetrafluoroethylene (PTFE) resin-based laminates for mmWave, 5G/6G wireless communications, and automotive radar modules with ultra-low loss characteristics, and laminates for 5G AiP, RFFE package substrate with excellent warpage control.
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