TSM-DS3

Laminate by Taconic (33 more products)

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TSM-DS3 Image

The TSM-DS3 family from Taconic is range of thermally stable, low loss laminates with very low fiberglass content (around 5%). These laminates are developed for high power applications and to have very low coefficients of thermal expansion for demanding thermal cycling. They have a high thermal conductivity of 0.65 W/m*K and low loss cores (Df = 0.0011 at 10 GHz). These ceramic-filled reinforced materials can be used in couplers, phased array antennas, radar manifolds, and oil drilling and automotive applications.  

Product Specifications

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Product Details

  • Part Number
    TSM-DS3
  • Manufacturer
    Taconic
  • Description
    Dimensionally Stable Low Loss Laminates up to 10 GHz

General Parameters

  • Dk (Dielectric Constant)
    3.0 +/- 0.05
  • Df (Dissipation Factor)
    0.0011
  • Frequency
    10 GHz
  • Applications
    ATE
  • Operating Temperature
    -30 to 120 Degrees C