MegaForm Image

MegaForm

RF Cable by MegaPhase

Note : Your request will be directed to MegaPhase.

The MegaForm from MegaPhase are Hand-Formable Jumper Cables that operate from 0.3 to 20 GHz. These cables are ideal for “on the fly” bending when semi-rigid cables are not practical. They can be hand formed in-place and eliminate the cost and design of semi-rigid cables that would need to fit in to a specific design.

These PTFE cables have an inner conductor of solid Ag-plated C-clad steel and an outer conductor of metallic alloy saturated Cu braid. They have a propagation velocity 69.5%, a time delay of 4.79 ns/m, and a capacitance of 96.8 pF/m. They also have a shielding effectiveness of 110 dB (cable only) and a VSWR of less than 1.35:1.

These Cable Assemblies are ideal for use in cabinet interconnects, ATE, and systems integration applications. They are available with 2.4 mm, 2.92 mm, 3.5 mm, MMCX, OSP, OSSP, SMA, SMB, SMC, SMP, SSMA, SSMB, SSMP, TNC, Type N, and ZMA connectors.

Product Specifications

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Product Details

  • Part Number
    MegaForm
  • Manufacturer
    MegaPhase
  • Description
    Hand-Formable Jumper Cables from 0.3 to 20 GHz

General Parameters

  • Type
    Hand-formable
  • Impedance
    50 Ohms
  • Frequency Range
    Up to 20 GHz
  • Cut off Frequency
    20 GHz
  • Propagation Velocity
    69.5 %
  • Time Delay
    1.46 ns/ft
  • Bend Radius
    0.25 in (0.635 cm) / 0.43 in (1.092 cm)
  • Dielectric
    PTFE
  • Dielectric Withstanding Voltage
    1.5 to 1.9 kV
  • Inner Conductor
    Solid Ag-plated C-clad Steel
  • Outer Conductor Material
    Metallic Alloy Saturated Cu Braid (Pb Free)
  • Outer Diameter
    0.085 in (0.216 cm) / 0.139 in (0.353 cm)
  • Shielding Effectiveness
    -110 dB
  • Connector
    2.4 mm, 2.92 mm, 3.5 mm, MMCX, OSP, OSSP, SMA, SMB, SMC, SMP, SSMA, SSMB, SSMP, TNC, N Type, ZMA
  • Capacitance
    29.5 pF/ft
  • Weight
    0.01 lbs/ft (0.018 kg/m), / 0.02 lbs/ft (0.030 kg/m)
  • Operating Temperature
    -65 to 200 Degree C
  • Note
    Application : Cabinet Interconnects, ATE, and Systems Integration.

Technical Documents

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