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CL6025

Wireless SoC by Celeno

Note : Your request will be directed to Celeno.

The CL6025 from Celeno is a 2x2 Wi-Fi 6/6E and Bluetooth 5.2 Chip with Celeno’s novel Wi-Fi Doppler Imaging technology for Wi-Fi sensing capabilities. The module supports Tri-band switchable Wi-Fi (at the 2.4 GHz, 5 GHz and 6 GHz bands) with a data rate of up to 2.4 Gbps and has 160 MHz channels. It supports 802.11ax R2 (Wi-Fi 6/6E) features like beamforming, Multi-User MIMO & OFDMA. The chipset also supports Bluetooth modulations and protocols like BT Classic, BR, EDR & BLE for excellent performance under dense and demanding deployments. It has a coexistence interface for external 3rd party radios based on other technologies like Thread, Zigbee, 802.15.4 etc.

The CL6025 can be controlled via PCIe v2.0, USB 2.0/3.0 and UART interfaces. It has efficient power saving features like Target Wait Time (TWT) and long sleep times. This connectivity/sensing chip is available in a Wafer Level Chip Scale Package (WLCSP) and is ideal for multimedia, sensing and Internet of Things (IoT) applications in the home, office, business or industrial scenarios.

Product Specifications

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Product Details

  • Part Number
    CL6025
  • Manufacturer
    Celeno
  • Description
    Tri-Band Wi-Fi 6/6E + Bluetooth 5.2 + Doppler Radar Chip for IoT Applications

General Parameters

  • Application
    IoT Applications in the Home, Office, Business or Industrial
  • Technology
    Bluetooth, Wi-Fi 6, Wi-Fi 6E, Thread, Zigbee
  • Frequency
    2.4 / 5 / 6 GHz
  • Bluetooth Standard
    Bluetooth V5.2
  • Bluetooth Low Energy
    Yes
  • WiFi Standard
    802.11ax
  • Data Rate
    Up to 2.4 Gbps
  • Interface
    Bluetooth, PCIe 2.0, UART, USB 2.0, USB 3.0
  • MIMO
    Yes
  • MU-MIMO
    Yes
  • Package
    Wafer Level Chip Scale Package (WLCSP)
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