The CYW55512 from Infineon Technologies is a Dual-Band 2.4/5 GHz Wi-Fi 6 and Bluetooth Low Energy (BLE) 5.4 Combo IC. It offers a cost-effective balance of advanced Wi-Fi 6 and Bluetooth/BLE features with a power efficient design for IoT connectivity needs. This Wireless SoC has a 192 MHz Cortex CM33 core processor and supports OFDMA, MU-MIMO, TWT, BSS Coloring and DCM technologies.
The CYW55512 has a channel bandwidth of 20 MHz and delivers a data rate of 2 Mbps (BLE) and 143 Mbps (Wi-Fi). This Wi-Fi 6 and Bluetooth/BLE 5.4 chip delivers a transmit power of up to +24 dBm and has a receive sensitivity of -111.5 dBm (LE long range). It has built-in WPA2/WPA3 security features, secure boot encryption, and authentication schemes to protect the data streams. This combo chip includes UART, SDIO, GSPI, TDM/I2S, 2-wire BTSIG WCI-2 (LTE), and 3-wire (Zigbee) interfaces for control. It requires a DC supply from 3 to 4.8 V.
The CYW55512 is available in a wafer-level ball grid array (WLBGA) package that measures 3.57 x 5.32 mm and is ideal for smart home, IP cameras, video door bells, smart door locks, appliances, smart watches, sensors, smart speakers, IoT, and industrial IoT applications.
