The 88W8897 from NXP Semiconductors is a 2 x 2 MIMO Wi-Fi (802.11a/b/g/n/ac) and Bluetooth V5.0 combo wireless module specifically designed to support the reliability and quality requirements of next-generation, very high throughput (VHT) WLAN products. This SoC offers one of the highest levels of integration available and enables a footprint reduction of 40-to-50 percent compared to previous wireless solutions. An internal coexistence arbitration and a mobile wireless systems (MWS) serial transport interface provide the functionality for connecting an external long-term evolution (LTE) device.
The module has a Wi-Fi data rate up to MCS9 (866.7 Mbit/s) supported with 802.11i security standards. The device supports 802.11h dynamic frequency selection (DFS) for detecting radar pulses when operating in the 5 GHz range and 802.11e Quality of Service (QoS) for video, voice, and multimedia applications. Dynamic rapid channel switching (DRCS) is also available, enabling concurrent STA, AP, and Wi-Fi Direct GO operating modes in separate channels. The module has generic interfaces that supports high-speed inter-chip (HSIC), USB 2.0, SDIO 3.0, low-power PCI Express, high-speed UART and PCM interfaces for connecting WLAN and Bluetooth to the host processor.
The device is available in QFN and CSP flip-chip package options. This SoC creates AOAC (Always on, Always Connected) Computing experience with mobile MIMO, transmit beam forming and supports WI-FI CERTIFIED Miracast specification for point-to-point HD video streaming. It includes advanced power management features and is designed specifically for ultra-books, gaming consoles and smart TVs.