88W8977 Image


Wireless SoC by NXP Semiconductors

The 88W8977 from NXP is a WLAN (2.4/5 GHz) and Bluetooth System-on-Chip (SoC) that has been specifically designed to support the speed, reliability, and quality requirements of next-generation products. It provides both simultaneous and independent operation of the IEEE 802.11n compliant 1x1 spatial stream and Bluetooth v4.2, as well as planned enhancements of Bluetooth technology including features such as higher speeds, and mesh networking for increased Internet of Things (IoT) functionality. The device also provides or 3-way coexistence for WLAN, Bluetooth, and ZigBee operation.

This SoC is available in QFN and eWLP package options with SDIO 3.0 and high-speed UART interfaces for connecting WLAN and Bluetooth technologies to the host processor and is ideal for mobile, wearables, IoT, IP cameras, and smart home applications. 

Product Specifications

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Product Details

  • Part Number
  • Manufacturer
    NXP Semiconductors
  • Description
    2.5/5 GHz WLAN + Bluetooth SoC for IoT Applications

General Parameters

  • Application
    IoT, Mobiles, IP Cameras, Wearables and Smart Home Applications
  • Technology
    WiFi + Bluetooth, Zigbee
  • Frequency
    2.4/5 GHz
  • Bluetooth Standard
    Bluetooth V4.2, Bluetooth V5
  • Bluetooth Application
  • Bluetooth Low Energy
  • WiFi Standard
    802.11e, 802.11i, 802.11n, 802.11a/b/g
  • WiFi Band
    2.4 GHz/5 GHz
  • Data Rate
    0 to 150 Mbps
  • Output Power
    10 dBm
  • Interface
  • Mesh
  • Power Amplifier
  • Package
    68-pin QFN / 74-bump eWLP

Technical Documents

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