88W8977 Image

88W8977

Wireless SoC by NXP Semiconductors

The 88W8977 from NXP is a WLAN (2.4/5 GHz) and Bluetooth System-on-Chip (SoC) that has been specifically designed to support the speed, reliability, and quality requirements of next-generation products. It provides both simultaneous and independent operation of the IEEE 802.11n compliant 1x1 spatial stream and Bluetooth v4.2, as well as planned enhancements of Bluetooth technology including features such as higher speeds, and mesh networking for increased Internet of Things (IoT) functionality. The device also provides or 3-way coexistence for WLAN, Bluetooth, and ZigBee operation.

This SoC is available in QFN and eWLP package options with SDIO 3.0 and high-speed UART interfaces for connecting WLAN and Bluetooth technologies to the host processor and is ideal for mobile, wearables, IoT, IP cameras, and smart home applications. 

Product Specifications

View similar products

Product Details

  • Part Number
    88W8977
  • Manufacturer
    NXP Semiconductors
  • Description
    2.5/5 GHz WLAN + Bluetooth SoC for IoT Applications

General Parameters

  • Application
    IoT, Mobiles, IP Cameras, Wearables and Smart Home Applications
  • Technology
    WiFi + Bluetooth, Zigbee
  • Frequency
    2.4/5 GHz
  • Bluetooth Standard
    Bluetooth V4.2, Bluetooth V5
  • Bluetooth Application
    Audio
  • Bluetooth Low Energy
    Yes
  • WiFi Standard
    802.11e, 802.11i, 802.11n, 802.11a/b/g
  • WiFi Band
    2.4 GHz/5 GHz
  • Data Rate
    0 to 150 Mbps
  • Output Power
    10 dBm
  • Interface
    SDIO, UART
  • Mesh
    Yes
  • Power Amplifier
    Yes
  • Package
    68-pin QFN / 74-bump eWLP

Technical Documents

Need Help Finding a Product?

Need Help?

Let us know what you need, we can help find products that meet your requirement.